NCV8184(2019) 데이터 시트보기 (PDF) - ON Semiconductor
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NCV8184 Datasheet PDF : 20 Pages
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NCV8184
90
85
80
75
1.0 oz Cu
70
TJ = 25°C
65
60
2.0 oz Cu
55
50
45
40
0
100
200
300
400
500
600
700
COPPER HEAT SPREADER AREA (mm2)
Figure 33. DPAK 5−Lead, θJA as a Function of the
Pad Copper Area, Board Material FR4
100
50% Duty Cycle
20%
10 10%
5%
2%
1 1%
Single Pulse
(1.0 in pad PCB) Die Size = 2.08 x 1.55 x 0.40 5.0% Active Area
0.1
0.000001 0.00001 0.0001 0.001
0.01
0.1
PULSE TIME (sec)
Notes:
1
PDM
t1
t2
t1
Duty Cycle, D = t 2
10
100
Figure 34. DPAK 5−Lead Thermal Duty Cycle Curves
on 1.0 in Spreader Test Board, 1.0 oz Cu
1000
100
Cu Area 100 mm2
Cu Area 645 mm2
10
1
0.1
0.000001
0.00001 0.0001 0.001
0.01
0.1
1
10
PULSE TIME (sec)
Figure 35. DPAK 5−Lead Single Pulse Heating Curve
100
1000
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