HCTS161AD 데이터 시트보기 (PDF) - Intersil
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HCTS161AD Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
86 x 104mils
2.19 x 2.65mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCTS161AMS
HCTS161AMS
CP
MR
(2)
(1)
VCC
(16)
P0 (3)
P1 (4)
P2 (5)
P3 (6)
(15) TC
(14) Q0
(13) Q1
(12) Q2
PE (7)
(11) Q3
(8)
(9)
(10)
GND
SPE
TE
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS161A is TA14446A.
Spec Number 518888
9
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