HCC4001BDG 데이터 시트보기 (PDF) - STMicroelectronics
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HCC4001BDG Datasheet PDF : 34 Pages
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HCC40xxx, HCC45xxx
Package information
5.6
Ceramic DIL-24 package information
Figure 8. Ceramic DIL-24 package outline
0016179 I
1. The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package.
Connecting unused pins or metal lid to ground or to the power supply does not affect the electrical
characteristics.
Table 12. Ceramic DIL-24 mechanical data
Dimensions
Ref
Millimeters
Inches(1)
Min
Typ
Max
A
2.159
1.931
2.387
a1
1.270
1.016
1.524
a2
0.307
0.274
0.340
B
1.270
b1
0.457
0.407
0.507
b2
.254
0.229
0.304
C
2.466
2.205
2.727
D
30.48
30.17
30.78
E
15.24
14.98
15.49
e
2.540
2.410
2.670
e3
27.94
27.81
28.06
F
15.11
14.85
15.36
K
12.80
12.60
13.00
K1
12.80
12.60
13.00
L
3.300
3.000
3.800
1. Values in inches are rounded to three decimal digits.
Min
0.085
0.050
0.012
0.050
0.018
0.010
0.097
1.200
0.600
0.100
1.100
0.595
0.504
0.504
0.130
Typ
0.076
0.040
0.011
0.016
0.009
0.087
1.188
0.590
0.095
1.095
0.585
0.496
0.496
0.118
Max
0.094
0.060
0.013
0.020
0.012
0.107
1.212
0.610
0.105
1.105
0.605
0.512
0.512
0.150
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