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HCC4001BDG 데이터 시트보기 (PDF) - STMicroelectronics

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HCC4001BDG
STMICROELECTRONICS
STMicroelectronics STMICROELECTRONICS
HCC4001BDG Datasheet PDF : 34 Pages
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HCC40xxx, HCC45xxx
4
Radiations
Radiations
4.1
Total ionizing dose (TID)
All devices of the HCC series are 100 krad guaranteed as per the test methods described in Table 4.
Table 4. TID test conditions for the CMOS4000B family
Test parameter
Test conditions
Total dose
Dose rate
Sampling
Bias
conditions(1)
Limits
100 krad(Si)
40 krad(Si)/h
4 biased parts by wafer on 3 wafer per diffusion lot plus 1 control part to qualify the
wafer lot. In case one wafer fails, qualification is done wafer per wafer on 4 biased
parts
VDD = 10 V(2)
inputs at Vdd(3)
|VTHN| < 2 V, |VTHP| < 2 V
VTHN, VTHP, IOL, IOH, TPHL, TPLH, VOL, VOH, VN, VP, VH: see section 2.3.1 of the
“ESCC detail specification”, limits ± 35 % for high and low limits
Others tests performed as defined in section 2.3.1 of the “ESCC detail
specification” with corresponding limits
1. During irradiation
2. Vdd = 10 Volt has been demonstrated to be the worst case condition during characterization
3. Whenever functionally pertinent
Figure 2. Irradiation test flow
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1. The post rad guaranteed Vcc min is therefore 5 V.
DocID17102 Rev 7
11/34
33

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