8405201XA 데이터 시트보기 (PDF) - Intersil

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8405201XA

CMOS 16-Bit Microprocessor

Intersil 

80C86

Absolute Maximum Ratings

Thermal Information

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V

Input, Output or I/O Voltage . . . . . . . . . . . .GND -0.5V to VCC +0.5V

Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC

Junction Temperature

Ceramic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC

Plastic Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150oC

Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300oC

(Lead tips only for surface mount packages)

ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1

Thermal Resistance (Typical, Note 1)

θJA (oC/W) θJC (oC/W)

PDIP Package . . . . . . . . . . . . . . . . . . .

50

N/A

PLCC Package . . . . . . . . . . . . . . . . . .

46

N/A

SBDIP Package . . . . . . . . . . . . . . . . . .

30

6

CLCC Package . . . . . . . . . . . . . . . . . .

40

6

Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9750 Gates

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

1. θJA is measured with the component mounted on an evaluation PC board in free air.

Operating Conditions

Operating Supply Voltage. . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V

M80C86-2 ONLY. . . . . . . . . . . . . . . . . . . . . . . . +4.75V to +5.25V

Operating Temperature Range: C80C86/-2 . . . . . . . . 0oC to +70oC

I80C86/-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to +85oC

M80C86/-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to +125oC

DC Electrical Specifications

VCC = 5.0V, ±10%; TA = 0oC to +70oC (C80C86, C80C86-2)

VCC = 5.0V, ±10%; TA = -40oC to +85oC (l80C86, I80C86-2)

VCC = 5.0V, ±10%; TA = -55oC to +125oC (M80C86)

VCC = 5.0V, ±5%; TA = -55oC to +125oC (M80C86-2)

SYMBOL

VlH

VIL

VIHC

VILC

VOH

PARAMETER

Logical One

Input Voltage

Logical Zero Input Voltage

CLK Logical One Input Voltage

CLK Logical Zero Input Voltage

Output High Voltage

VOL

Output Low Voltage

II

Input Leakage Current

lBHH

lBHL

IO

ICCSB

ICCOP

Input Current-Bus Hold High

Input Current-Bus Hold Low

Output Leakage Current

Standby Power Supply Current

Operating Power Supply Current

MIN

2.0

2.2

VCC -0.8

3.0

VCC -0.4

-1.0

-40

40

-

-

-

MAX

0.8

0.8

0.4

1.0

-400

400

-10.0

500

10

UNITS

V

V

V

V

V

V

V

V

µA

µA

µA

µA

µA

mA/MHz

TEST CONDITION

C80C86, I80C86 (Note 5)

M80C86 (Note 5)

lOH = -2.5mA

lOH = -100µA

lOL = +2.5mA

VIN = GND or VCC DIP

Pins 17-19, 21-23, 33

VIN = - 3.0V (Note 1)

VIN = - 0.8V (Note 2)

VOUT = GND (Note 4)

VCC = - 5.5V (Note 3)

FREQ = Max, VIN = VCC or GND,

Outputs Open

Capacitance TA = 25oC

SYMBOL

PARAMETER

TYPICAL UNITS

TEST CONDITIONS

CIN

Input Capacitance

25

pF

FREQ = 1MHz. All measurements are referenced to device GND

COUT Output Capacitance

25

pF

FREQ = 1MHz. All measurements are referenced to device GND

CI/O

I/O Capacitance

25

pF

FREQ = 1MHz. All measurements are referenced to device GND

NOTES:

2. lBHH should be measured after raising VIN to VCC and then lowering to 3.0V on the following pins 2-16, 26-32, 34-39.

3. IBHL should be measured after lowering VIN to GND and then raising to 0.8V on the following pins: 2-16, 34-39.

4. lCCSB tested during clock high time after halt instruction executed. VIN = VCC or GND, VCC = 5.5V, Outputs unloaded.

5. IO should be measured by putting the pin in a high impedance state and then driving VOUT to GND on the following pins: 26-29 and 32.

6. MN/MX is a strap option and should be held to VCC or GND.

3-156

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