LLL317R71H103MD01K 데이터 시트보기 (PDF) - Unspecified

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LLL317R71H103MD01K

Chip Multilayer Ceramic Capacitors for General

Unspecified 

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

C02E.pdf

Nov.27,2017

Notice

Continued from the preceding page.

7. Washing

1. Please evaluate the capacitor using actual cleaning

equipment and conditions to confirm the quality, and

select the solvent for cleaning.

2. Unsuitable cleaning may leave residual flux or other

foreign substances, causing deterioration of electrical

characteristics and the reliability of the capacitors.

8. Coating

1. A crack may be caused in the capacitor due to the stress

of the thermal contraction of the resin during curing

process.

The stress is a ected by the amount of resin and curing

contraction.

Select a resin with low curing contraction.

The di erence in the thermal expansion coe cient

between a coating resin or a molding resin and the

capacitor may cause the destruction and deterioration of

the capacitor such as a crack or peeling, and lead to the

deterioration of insulation resistance or dielectric

breakdown.

Select a resin for which the thermal expansion coefficient

is as close to that of the capacitor as possible.

A silicone resin can be used as an under-coating to bu er

against the stress.

2. Select a resin that is less hygroscopic.

Using hygroscopic resins under high humidity conditions

may cause the deterioration of the insulation resistance

of a capacitor.

An epoxy resin can be used as a less hygroscopic resin.

3. The halogen system substance and organic acid are

included in coating material, and a chip corrodes by the

kind of Coating material.

Do not use strong acid type.

<Applicable to ZRB Series>

4. Loss suppress acoustic noise may be caused in ZRB series

due to the resin during curing process. Please contact our

sales representative or product engineers on the apply to

resin during curing process.

Other

1. Transportation

1. The performance of a capacitor may be a ected by the

conditions during transportation.

1-1. The capacitors shall be protected against excessive

temperature, humidity, and mechanical force during

transportation.

(1) Climatic condition

• low air temperature: -40°C

• change of temperature air/air: -25°C/+25°C

• low air pressure: 30 kPa

• change of air pressure: 6 kPa/min.

(2) Mechanical condition

Transportation shall be done in such a way that

the boxes are not deformed and forces are not

directly passed on to the inner packaging.

1-2. Do not apply excessive vibration, shock, or pressure

to the capacitor.

(1) When excessive mechanical shock or pressure is

applied to a capacitor, chipping or cracking may

occur in the ceramic body of the capacitor.

(2) When the sharp edge of an air driver, a soldering

iron, tweezers, a chassis, etc. impacts strongly on

the surface of the capacitor, the capacitor may

crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was

applied by dropping, etc.

A capacitor dropped accidentally during processing

may be damaged.

2. Characteristics Evaluation in the Actual System

1. Evaluate the capacitor in the actual system, to confirm

that there is no problem with the performance and

specification values in a finished product before using.

2. Since a voltage dependency and temperature

dependency exists in the capacitance of high dielectric

type ceramic capacitors, the capacitance may change

depending on the operating conditions in the actual

system. Therefore, be sure to evaluate the various

characteristics, such as the leakage current and noise

absorptivity, which will affect the capacitance value of

the capacitor.

3. In addition, voltages exceeding the predetermined surge

may be applied to the capacitor by the inductance in the

actual system. Evaluate the surge resistance in the actual

system as required.

<Applicable to NFM Series>

4. The effects of noise suppression can vary depending on

the usage conditions, including di erences in the circuit

or IC to be used, the type of noise, the shape of the

pattern to be mounted, and the mounting location. Be

sure to verify the e ect on the actual device in advance.

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