LLL317R71H103MD01K 데이터 시트보기 (PDF) - Unspecified

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LLL317R71H103MD01K

Chip Multilayer Ceramic Capacitors for General

Unspecified 

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

Continued from the preceding page.

2. Information before Mounting

1. Do not re-use capacitors that were removed from the

equipment.

2. Confirm capacitance characteristics under actual applied

voltage.

3. Confirm the mechanical stress under actual process and

equipment use.

4. Confirm the rated capacitance, rated voltage and other

electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that

were in long-term storage.

6. Prior to measuring capacitance, carry out a heat

treatment for capacitors that were in long-term storage.

7. The use of Sn-Zn based solder will deteriorate the

reliability of the MLCC.

Please contact our sales representative or product

engineers on the use of Sn-Zn based solder in advance.

8. We have also produced a DVD which shows a summary of

our recommendations, regarding the precautions for

mounting. Please contact our sales representative to

request the DVD.

C02E.pdf

Nov.27,2017

3. Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not

applied to the capacitors. Check the mounting in the

actual device under actual use conditions ahead of time.

1-1. In mounting the capacitors on the printed circuit

board, any bending force against them shall be kept

to a minimum to prevent them from any damage or

cracking. Please take into account the following

precautions and recommendations for use in your

process.

(1) Adjust the lowest position of the pickup nozzle so

as not to bend the printed circuit board.

2. Dirt particles and dust accumulated in the suction nozzle

and suction mechanism prevent the nozzle from moving

smoothly. This creates excessive force on the capacitor

during mounting, causing cracked chips. Also, the locating

claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction

nozzle and the locating claw must be maintained,

checked, and replaced periodically.

<Applicable to ZRB Series>

3. To adjust the inspection tolerance for automated

appearance sorting machine of mounting position,

because ZRB series are easier to shi the mounting

position than standard MLCC.

4. To check the overturn and reverse of chip.

5. To control mounting speed carefully, because ZRB series

is heavier than standard MLCC.

272

[Incorrect]

Suction Nozzle

[Correct]

Board

Deflection

Board Guide

Support Pin

Continued on the following page.

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