LLL317R71H103MD01K 데이터 시트보기 (PDF) - Unspecified

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LLL317R71H103MD01K

Chip Multilayer Ceramic Capacitors for General

Unspecified 

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Caution

Continued from the preceding page.

7. Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its

condition, and any generation of resonance.

Please mount the capacitor so as not to generate

resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to being dropped may cause

damage or a crack in the dielectric material of the

capacitor.

Do not use a dropped capacitor because the quality and

reliability may be deteriorated.

Crack

3. When printed circuit boards are piled up or handled, the

corner of another printed circuit board should not be

allowed to hit the capacitor, in order to avoid a crack or

other damage to the capacitor.

Floor

Mounting printed circuit board

Crack

C02E.pdf

Nov.27,2017

Soldering and Mounting

1. Mounting Position

1. Confirm the best mounting position and direction that

minimizes the stress imposed on the capacitor during

flexing or bending the printed circuit board.

1-1. Choose a mounting position that minimizes the

stress imposed on the chip during flexing or bending

of the board.

<Applicable to NFM Series>

2. If you mount the capacitor near components that

generate heat, take note of the heat from the other

components and carefully check the self-heating of the

capacitor before using.

If there is significant heat radiation from other

components, it could lower the insulation resistance of

the capacitor or produce excessive heat.

[Component Direction]

(Bad Example)

(Good Example)

Locate chip

horizontal to

the direction in

which stress

acts.

[Chip Mounting Close to Board Separation Point]

It is e ective to implement the following measures, to reduce stress

in separating the board.

It is best to implement all of the following three measures; however,

implement as many measures as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component

parallel to the board separation surface.

A > D *1

(2) Add slits in the board separation part.

A>B

(3) Keep the mounting position of the component

away from the board separation surface.

A>C

Perforation

C

B

D

A

Slit

*1 A > D is valid when stress is added vertically to the perforation as with

Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore

A > D is invalid.

[Mounting Capacitors Near Screw Holes]

When a capacitor is mounted near a screw hole, it may be a ected

by the board deflection that occurs during the tightening of the

screw. Mount the capacitor in a position as far away from the

screw holes as possible.

Screw Hole

Recommended

Continued on the following page.

271

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