74ALVT16827(2018) 데이터 시트보기 (PDF) - NXP Semiconductors.
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74ALVT16827 Datasheet PDF : 14 Pages
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Nexperia
74ALVT16827
20-bit buffer/line driver; non-inverting; 3-state
11 Package outline
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm
SOT364-1
D
y
Z
56
E
A
X
c
HE
vM A
29
pin 1 index
1
e
A2
A1
28
wM
bp
Q
(A 3 )
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
14.1
13.9
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.5
0.1
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT364-1
REFERENCES
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Figure 8. Package outline SOT364-1 (TSSOP56)
74ALVT16827
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 January 2018
© Nexperia B.V. 2018. All rights reserved.
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