ADV7480WBBCZ 데이터 시트보기 (PDF) - Analog Devices
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ADV7480WBBCZ Datasheet PDF : 19 Pages
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Data Sheet
OUTLINE DIMENSIONS
A1 BALL
CORNER
9.10
9.00 SQ
8.90
*1.400
1.253
1.173
TOP VIEW
DETAIL A
7.20
BSC SQ
0.80
BSC
0.90
REF
0.383
0.343
0.303
10 9 8 7 6 5 4 3 2 1
A1 BALL
CORNER
A
B
C
D
E
F
G
H
J
K
BOTTOM VIEW
0.26
REF DETAIL A
0.975
0.910
0.845
SEATING
PLANE
0.50
0.45
0.40
BALL DIAMETER
COPLANARITY
0.12
*COMPLIANT TO JEDEC STANDARDS MO-275-DDAB-1
WITH THE EXCEPTION TO PACKAGE HEIGHT
Figure 14. 100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-100-4)
Dimensions shown in millimeters
ADV7480
ORDERING GUIDE
Model1, 2, 3
ADV7480WBBCZ
ADV7480WBBCZ-RL
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
100-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Package Option
BC-100-4
BC-100-4
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
3 This device is programmed with internal HDCP keys. Customer must have HDCP adopter status (consult Digital Protection, LLC, for licensing requirements) to
purchase any components with internal HDCP keys.
AUTOMOTIVE PRODUCTS
The ADV7480W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
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