MF0ICU1 데이터 시트보기 (PDF) - NXP Semiconductors.
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MF0ICU1 Datasheet PDF : 31 Pages
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NXP Semiconductors
4. Ordering information
Table 3. Ordering information
Type number
Package
Commercial
Name
MF0ICU1001W/S7DL FFC
Name
-
MF0ICU1101W/S7DL FFC
-
MF0ICU1001W/U7DL FFC
-
MF0ICU1101W/U7DL FFC
-
MF0MOA4U10/D
MOA4
5. Block diagram
PLLMC
MF0ICU1
MIFARE Ultralight contactless single-ticket IC
Description
Version
8 inch wafer, sawn, 75 m thickness, on film
frame carrier, electronic fail die marking
according to SECSII format, Au bumps, 17 pF
input capacitance
8 inch wafer, sawn, 75 m thickness, on film
frame carrier, electronic fail die marking
according to SECSII format, Au bumps, 50 pF
input capacitance
8 inch wafer, sawn, 120 m thickness, on film
frame carrier, electronic fail die marking
according to SECSII format, Au bumps, 17 pF
input capacitance
8 inch wafer, sawn, 120 m thickness, on film
frame carrier, electronic fail die marking
according to SECSII format, Au bumps, 50 pF
input capacitance
plastic leadless module carrier package; 35 mm
SOT500-2 wide tape, 17 pF input capacitance
-
-
-
-
SOT500-2
DIGITAL CONTROL UNIT
antenna
RF INTERFACE
ANTICOLLISION
COMMAND
INTERPRETER
EEPROM
INTERFACE
Fig 2. Block diagram
EEPROM
001aal339
028639
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.9 — 23 July 2014
028639
© NXP Semiconductors N.V. 2014. All rights reserved.
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