8. RECOMMENDED FOOTPRINT
8-1. Land Pattern Dimension (ref)
Adjacent land patterns and lines on the PCB should
be covered with resist.
Dimensions in mm
8-2. Test PCB Dimension
Substrate Bending Test Board
Glass epoxy t = 1.6mm
100
50
φ4.5
20
30
Dimensions in mm
9. RECOMMENDED SOLDERING PROFILE (REFLOW ONLY)
9-1. Profile for Pb-Free Solder
9-2. Profile for Sn-Pb Solder
Peak 245°C
230°C
150~180°C
10~30sec.
Natural
cooling
Peak 230°C
200°C
150°C
20sec. max.
Natural
cooling
60~120sec.
60~120sec.
9-3. Iron Soldering
Use a solder iron of less than 30W. When soldering, do not allow the soldering iron tip to
directly touch the ferrite body outside of the terminal electrode. 3 seconds max. at 350°C.
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