LGJ7045TC-D 데이터 시트보기 (PDF) - TDK Corporation

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LGJ7045TC-D

WOUND/STD INDUCTOR, MAGNETIC SHIELDED LGJ7045TC-D SERIES HIGH RELIABILITY GRADE

TDK Corporation 

7. PERFORMANCE

No.

Item

1 High Temperature

Exposure (Storage)

2 Temperature Cycling

3 Biased Humidity

4 Operational Life

5 External Visual

6 Physical Dimensions

Performance

∆L/L0 ≦±5%

There shall be no

mechanical damage.

∆L/L0 ≦±5%

There shall be no

mechanical damage.

∆L/L0 ≦±5%

There shall be no

mechanical damage.

∆L/L0 ≦±5%

There shall be no

mechanical damage.

No Visual Damage

Section 3. Shapes and Dimensions

7 Resistance to Solvents

8 Mechanical Shock

9 Vibration

10 Resistance to

Soldering Heat

11 Solderability

No Visual Damage

∆L/L0 ≦±5%

There shall be no

mechanical damage.

∆L/L0 ≦±5%

There shall be no

mechanical damage.

∆L/L0 ≦±5%

There shall be no

mechanical damage.

Covered by New Solder

over 95%.

12 Electrical

Characterization

13 Board Flex

14 Terminal Strength (SMD)

∆L/L20°C ≦±15%

∆L/L0 ≦±5%

There shall be no

mechanical damage.

∆L/L0 ≦±5%

There shall be no

mechanical damage.

Test Condition / Inspection Method

MIL-STD-202 Method 108

150°C / 2000h

JESD22 Method JA-104

-40/+150°C (Dwell 30min) / 2000cycles

MIL-STD-202 Method 103

85°C 85%R.H. / 2000h

MIL-PRF-27

125°C / 2000h

Current rating is energized.

MIL-STD-883 Method 2009

JESD22 Method JB-100

Length , Width , Height dimension

MIL-STD-202 Method 215

MIL-STD-202 Method 213 Method 213

Peak:100G Half-sine / Duration:6ms /

Number of times:6axis x 3times

MIL-STD-202 Method 204

10-2000Hz / 5G or 1.52mmP-P /

20 min x 12 cycles x 3axis

MIL-STD-202 Method 210

Test Type: Dip Solder: 260°C Dipping Time:10sec

J-STD-002

Method B, 4hrs@235°C, category 3

J-STD-002

Method B, @215°C, category 3

Inductance change rate based on 20°C

(-40～150°C)

AEC-Q200-005

2mm / 60sec

AEC-Q200-006

17.7N / 60sec

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