SS24T3G(2005) 데이터 시트보기 (PDF) - ON Semiconductor
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SS24T3G Datasheet PDF : 6 Pages
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SS22, SS24
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
These devices employ the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Over−Voltage Protection
• Low Forward Voltage Drop
• Pb−Free Package is Available
Mechanical Characteristics
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 95 mg (approximately)
• Cathode Polarity Band
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Available in 12 mm Tape, 2500 Units per 13 in Reel, Add “T3”
Suffix to Part Number
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2 AMPERES
20, 40 VOLTS
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
AYWW
SS2xG
G
SS2x = Specific Device Code
x
= 2 or 4
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 2
ORDERING INFORMATION
Device
Package
Shipping†
SS22T3
SMB
2500/Tape & Reel
SS24T3
SMB
2500/Tape & Reel
SS24T3G
SMB
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1
Publication Order Number:
SS24/D
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