T510E687K006ATE023 데이터 시트보기 (PDF) - Unspecified
부품명
상세내역
일치하는 목록
T510E687K006ATE023 Datasheet PDF : 219 Pages
| |||
Tantalum Surface Mount Capacitors – Low ESR
T494 Series Industrial Grade MnO2
Soldering Process
KEMET’s families of surface mount capacitors are compatible
with wave (single or dual), convection, IR, or vapor phase reflow
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended profile
conditions for convection and IR reflow reflect the profile conditions
of the IPC/J–STD–020D standard for moisture sensitivity testing.
The devices can safely withstand a maximum of three reflow
passes at these conditions.
Please note that although the X/7343–43 case size can withstand
wave soldering, the tall profile (4.3 mm maximum) dictates care in
wave process development.
Profile Feature
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (ts) from Tsmin to Tsmax)
Ramp-up Rate (TL to TP)
Liquidous Temperature (TL)
Time Above Liquidous (tL)
Peak Temperature (TP)
Time within 5°C of Maximum
Peak Temperature (tP)
Ramp-down Rate (TP to TL)
SnPb Assembly Pb-Free Assembly
100°C
150°C
60 – 120 seconds
3°C/seconds maximum
183°C
60 – 150 seconds
220°C*
235°C**
20 seconds maximum
6°C/seconds maximum
150°C
200°C
60 – 120 seconds
3°C/seconds maximum
217°C
60 – 150 seconds
250°C*
260°C**
30 seconds maximum
6°C/seconds maximum
Time 25°C to Peak Temperature 6 minutes maximum
8 minutes maximum
Hand soldering should be performed with care due to the difficulty
in process control. If performed, care should be taken to avoid
contact of the soldering iron to the molded case. The iron should
be used to heat the solder pad, applying solder between the pad
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
and the termination, until reflow occurs. Once reflow occurs, the
iron should be removed immediately. “Wiping” the edges of a chip
and heating the top surface is not recommended.
During typical reflow operations, a slight darkening of the gold-
colored epoxy may be observed. This slight darkening is normal
TP
Maximum Ramp Up Rate = 3ºC/seconds
tP
Maximum Ramp Down Rate = 6ºC/seconds
TL
tL
Tsmax
and not harmful to the product. Marking permanency is not
Tsmin
affected by this change.
tS
25
25ºC to Peak
Time
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 60%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years
of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
TC10T22_0L0O8W_TE4S9R4 • 12/2/2014 195
Share Link: 