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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

T510E687K006ATE023 데이터 시트보기 (PDF) - Unspecified

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T510E687K006ATE023 Datasheet PDF : 219 Pages
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Tantalum Surface Mount Capacitors – Low ESR
T494 Series Industrial Grade MnO2
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The
positive terminal is identified on the capacitor body by a stripe plus in some cases a beveled edge. A small degree of transient reverse
voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within
these limits.
Temperature
25°C
85°C
125°C
Permissible Transient Reverse Voltage
15% of Rated Voltage
5% of Rated Voltage
1% of Rated Voltage
Table 2 – Land Dimensions/Courtyard
KEMET
Case
A
Metric
Size
Code
EIA
3216–18
B
3528–21
C
6032–25
D
7343–31
E1
7360–38
S2
3216–12
T
3528–12
U
6032–15
V
7343–20
X1
7343–43
Density Level A:
Maximum (Most) Land
Protrusion (mm)
W
L
S
V1 V2
1.35 2.20 0.62 6.02 2.80
2.35 2.21 0.92 6.32 4.00
2.35 2.77 2.37 8.92 4.50
2.55 2.77 3.67 10.22 5.60
4.25 2.77 3.67 10.22 7.30
1.35 2.20 0.62 6.02 2.80
2.35 2.20 0.92 6.32 4.00
2.35 2.77 2.37 8.92 4.50
2.55 2.77 3.67 10.22 5.60
2.55 2.77 3.67 10.22 5.60
Density Level B:
Median (Nominal) Land
Protrusion (mm)
W
L
S
V1 V2
1.23 1.80 0.82 4.92 2.30
2.23 1.80 1.12 5.22 3.50
2.23 2.37 2.57 7.82 4.00
2.43 2.37 3.87 9.12 5.10
4.13 2.37 3.87 9.12 6.80
1.23 1.80 0.82 4.92 2.30
2.23 1.80 1.12 5.22 3.50
2.23 2.37 2.57 7.82 4.00
2.43 2.37 3.87 9.12 5.10
2.43 2.37 3.87 9.12 5.10
Density Level C:
Minimum (Least) Land
Protrusion (mm)
W
L
S
V1 V2
1.13 1.42 0.98 4.06 2.04
2.13 1.42 1.28 4.36 3.24
2.13 1.99 2.73 6.96 3.74
2.33 1.99 4.03 8.26 4.84
4.03 1.99 4.03 8.26 6.54
1.13 1.42 0.98 4.06 2.04
2.13 1.42 1.28 4.36 3.24
2.13 1.99 2.73 6.96 3.74
2.33 1.99 4.03 8.26 4.84
2.33 1.99 4.03 8.26 4.84
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC standard 7351 (IPC–7351).
¹ Height of these chips may create problems in wave soldering.
2 Land pattern geometry is too small for silkscreen outline.
V1
L
L
W
W
V2
S
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
TC10T22_0L0O8W_TE4S9R4 • 12/2/2014 184

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