TGA4505 데이터 시트보기 (PDF) - TriQuint Semiconductor
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TGA4505 Datasheet PDF : 10 Pages
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Mechanical Drawing
TGA4505
3.019 [0.119]
2.903 [0.114]
2
3
4
2.888 [0.114]
1.507 [0.059]
1
0.142 [0.006]
0.132 [0.005]
0.117 [0.005]
14
13
12
0.000 [0.000]
5
6
7
2.902 [0.114]
2.878 [0.113]
2.874 [0.113]
8
1.511 [0.059]
11
10
9
0.150 [0.006]
0.142 [0.006]
0.118 [0.005]
Units: millimeters (inches)
Thickness: 0.050 (0.002) (reference only)
Chip edge to bond pad dimensions are shown to center of pad
Chip size: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
Bond Pad #1:
Bond Pad #2:
Bond Pad #3:
Bond Pad #4:
Bond Pad #5:
Bond Pad #6:
Bond Pad #7:
Bond Pad #8:
Bond Pad #9:
Bond Pad #10:
Bond Pad #11:
Bond Pad #12:
Bond Pad #13:
Bond Pad #14:
RF IN
VG1
VD1
VG2
VD2
VG3
VD3
RF OUT
VD3
VG3
VD2
VG2
VD1
VG1
0.130 x 0.205 (0.005 x 0.008)
0.080 x 0.080 (0.003 x 0.003)
0.143 x 0.103 (0.006 x 0.004)
0.105 x 0.105 (0.004 x 0.004)
0.205 x 0.105 (0.008 x 0.004)
0.080 x 0.080 (0.003 x 0.003)
0.095 x 0.130 (0.004 x 0.005)
0.130 x 0.205 (0.005 x 0.008)
0.095 x 0.130 (0.004 x 0.005)
0.080 x 0.080 (0.003 x 0.003
0.205 x 0.145 (0.008 x 0.006)
0.105 x 0.105 (0.004 x 0.004)
0.145 x 0.105 (0.006 x 0.004)
0.080 x 0.080 (0.003 x 0.003
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
7
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2009 © Rev -
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