STV8162 데이터 시트보기 (PDF) - STMicroelectronics

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STV8162

+5 V, +5 V and +8 V Triple-Voltage Regulator with Disable and Reset Functions

STMicroelectronics 

Power Dissipation and Layout Indications

STV8162 - STV8162D

5 Power Dissipation and Layout Indications

The power is mainly dissipated by the three device buffers. It can be calculated by the equation:

P = (VIN1-VOUT1) x IOUT1 + (VIN2-VOUT2) x IOUT2 + (VIN3-VOUT3) x IOUT3

The following table lists the different RthJA values of these packages with or without a heat sink and

the corresponding maximum power dissipation assuming:

● Maximum Ambient Temperature = 70° C

● Maximum Junction Temperature = 140° C

Device

STV8162

STV8162D

Heat Sink

No

Yes

No

Yes

RthJA in °C/W

50

15

56 to 40

32

PMAX in W

1.4

4.6

1.25 to 1.75

2.2

Figure 7: Thermal Resistance (Junction-to-Ambient) of DIP18 Package without Heat Sink

To optimize the thermal conductivity of the copper

60

layer and the exchanges with the air, the solder

must cover the maximum amount of this area.

55

Test Board with

50

“On Board” square heat sink area.

45

40

0

2

4

6

8

10 12

Copper area (cm²) (35 µm plus solder) Board is face-down

Figure 8: Metal plate mounted near the STV8162D for heat sinking

8/12

Top View

Bottom View

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