STTH5L06RL 데이터 시트보기 (PDF) - STMicroelectronics
부품명
상세내역
일치하는 목록
STTH5L06RL Datasheet PDF : 10 Pages
| |||
Package information
STTH5L06
Table 8. DPAK dimensions
E
B2
L2
A
C2
H
L4
B
G
D
R
A1
R
C
A2
0.60 MIN.
V2
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
2.20
2.40 0.086 0.094
A1 0.90
1.10 0.035 0.043
A2 0.03
0.23 0.001 0.009
B
0.64
0.90 0.025 0.035
B2 5.20
5.40 0.204 0.212
C
0.45
0.60 0.017 0.023
C2 0.48
0.60 0.018 0.023
D
6.00
6.20 0.236 0.244
E
6.40
6.60 0.251 0.259
G 4.40
4.60 0.173 0.181
H
9.35
10.10 0.368 0.397
L2
0.80 typ.
0.031 typ.
L4 0.60
1.00 0.023 0.039
V2
0°
8°
0°
8°
Figure 16. DPAK footprint (dimensions in mm)
6.7
3
3
1.6
2.3
6.7
2.3
1.6
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
8/10
Share Link: 