RT9013B 데이터 시트보기 (PDF) - Richtek Technology

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RT9013B

300mA, Low Dropout, Low Noise Ultra-Fast Without Bypass Capacitor CMOS LDO Regulator

Richtek Technology 

RT9013B

junction to ambient. The maximum power dissipation can

be calculated by following formula :

PD(MAX) = ( TJ(MAX) − TA ) /θJA

Where TJ(MAX) is the maximum operation junction

temperature, TA is the ambient temperature and the θJA is

the junction to ambient thermal resistance.

For recommended operating conditions specification of the

RT9013B, where TJ(MAX) is the maximum junction

temperature of the die (125°C) and TA is the operated

ambient temperature. The junction to ambient thermal

resistance for SC-70-5 package is 333°C/W and

WDFN-6L 1.6x1.6 package is 165°C/W on the standard

JEDEC 51-3 single-layer thermal test board. The maximum

power dissipation at TA = 25°C can be calculated by

following formula :

PD(MAX) = (125°C − 25°C) / (333°C/W) = 0.3W for SC-70-5

packages

PD(MAX) = (125°C − 25°C) / (165°C/W) = 0.606W for

WDFN-6L 1.6x1.6 packages

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal resistance

θJA. For RT9013B packages, the Figure 2 of derating curves

allows the designer to see the effect of rising ambient

temperature on the maximum power allowed.

0.8

Single Layer PCB

0.7

0.6

WDFN-6L 1.6x1.6

0.5

0.4

SC-70-5

0.3

0.2

0.1

0

0

25

50

75

100

125

Ambient Temperature (°C)

Figure 2. Derating Curves for RT9013B Packages

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DS9013B-02 April 2011

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