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NCP348

Positive Overvoltage Protection Controller with Internal Low RON NMOS FET and Status FLAG

ON Semiconductor 

NCP348, NCP348AE

PIN FUNCTION DESCRIPTION

Pin No. Symbol Function

Description

1

IN

POWER Input Voltage Pin.

4

This pin is connected to the power supply.

5

The device system core is supplied by this input.

A 1 mF low ESR ceramic capacitor, or larger, must be connected between this pin and GND.

The three IN pins must be hardwired to common supply.

2

GND

POWER Ground

3

FLAG

OUTPUT Fault Indication Pin.

This pin allows an external system to detect a fault on IN pin.

The FLAG pin goes low when input voltage exceeds OVLO threshold or drop below UVLO threshold.

Since the FLAG pin is open drain functionality, an external pull up resistor to VCC must be added.

6

OUT

OUTPUT Output Voltage Pin.

7

This pin follows IN pin when “no fault” is detected.

The output is disconnected from the Vin power supply when the input voltage is under the UVLO

threshold or above OVLO threshold.

The two OUT pins must be hardwired to common supply.

8

NC

OPEN No Connect

9

NC

OPEN No Connect

10

EN

INPUT Enable Pin.

The device enters in shutdown mode when this pin is tied to a high level. In this case the output is

disconnected from the input.

To allow normal functionality, the EN pin shall be connected to GND to a pull down or to a I/O pin.

This pin does not have an impact on the fault detection.

PAD1

PAD1, under the device. See PCB recommendations page 10.

Can be shorted to GND.

PAD2

The PAD2 is electrically connected to the internal NMOS drain and connected to Pins 4 and 5.

See PCB recommendations page 10.

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Minimum Voltage (IN to GND)

Minimum Voltage (All others to GND)

Vminin

−0.3

V

Vmin

−0.3

V

Maximum Voltage (IN to GND)

Maximum Voltage (All others to GND)

Vmaxin

30

V

Vmax

7.0

V

Maximum Current (UVLO<VIN<OVLO)

Thermal Resistance, Junction−to−Air (Note 1)

Operating Ambient Temperature Range

Storage Temperature Range

Junction Operating Temperature

ESD Withstand Voltage (IEC 61000−4−2) (input only) when bypassed with 1.0 mF capacitor

Human Body Model (HBM), Model = 2 (Note 2)

Machine Model (MM) Model = B (Note 3)

Imax

RqJA

TA

Tstg

TJ

Vesd

2.0

280

−40 to +85

−65 to +150

150

15 Air, 8.0 Contact

2000

200

A

°C/W

°C

°C

°C

kV

V

V

Moisture Sensitivity

MSL

Level 1

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The RqJA is highly dependent on the PCB heat sink area (connected to pad 2). As example RqJA is 268 °C/W with 30 mm2 (copper 35 mm) and

189 °C/W with 400 mm2.

2. Human Body Model, 100 pF discharged through a 1.5 kW resistor following specification JESD22/A114.

3. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.

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