MAX3982 데이터 시트보기 (PDF) - Maxim Integrated

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MAX3982

SFP Copper-Cable Preemphasis Driver

Maxim Integrated 

SFP Copper-Cable Preemphasis Driver

PIN

1

2

3

4, 8, 9

5

6

7

10

11

12, 13

14

15

16

EP

Pin Description

NAME

VCC1

IN+

IN-

GND

OUTLEV

FUNCTION

Power-Supply Connection for Input. Connect to +3.3V.

Positive Data Input, CML. This input is internally terminated with 50Ω to VCC1.

Negative Data Input, CML. This input is internally terminated with 50Ω to VCC1.

Circuit Ground

Output-Swing Control Input, LVTTL with 40kΩ Internal Pullup. Set to TTL high or open for maximum

output swing, or set to TTL low for reduced swing.

PE1

Output Preemphasis Control Input, LVTTL with 10kΩ Internal Pullup. This pin is the most significant bit

of the 2-bit preemphasis control. Set high or open to assert this bit.

PE0

Output Preemphasis Control Input, LVTTL with 10kΩ Internal Pullup. This pin is the least significant bit

of the 2-bit preemphasis control. Set high or open to assert this bit.

OUT-

OUT+

VCC2

Negative Data Output, CML. This output is terminated with 50Ω to VCC2.

Positive Data Output, CML. This output is terminated with 50Ω to VCC2.

Power-Supply Connection for Output. Connect to +3.3V.

TX_DISABLE Transmitter Disable Input, LVTTL with 10kΩ Internal Pullup. When high or open, differential output is

40mVP-P. Set low for normal operation.

Loss-of-Signal Detect, TTL Output. This output is open-collector TTL, and therefore requires an external

LOS

4.7kΩ to 10kΩ pullup resistor (5.5V maximum). This output sinks current when the input signal level is

valid.

LOSLEV

LOS Sensitivity Control Input, LVTTL with 40kΩ Internal Pullup. Set to TTL high or open for less

sensitivity (higher assert threshold). Set to TTL low for more sensitivity (lower assert threshold).

EXPOSED Exposed Pad. For optimal thermal conductivity, this pad must be soldered to the circuit board ground.

PAD

Pin Configuration

TOP VIEW

VCC1 1

IN+ 2

IN- 3

GND 4

16 15 14 13

MAX3982UTE

EXPOSED PAD*

5678

12 VCC2

11 OUT+

10 OUT-

9 GND

THIN QFN

*THE EXPOSED PAD OF THE QFN PACKAGE MUST BE SOLDERED TO GROUND

FOR PROPER THERMAL OPERATION OF THE MAX3982.

10 ______________________________________________________________________________________

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