HC1-5509A1-5 데이터 시트보기 (PDF) - Intersil
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HC1-5509A1-5 Datasheet PDF : 10 Pages
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HC-5509A1
Applications Diagram
RS1 CS1
+5V
K2
+5V
K1
K1A
TIP
RB1
RB2
*SECONDARY
PROTECTION
C5
VB-
PRIMARY
PROTECTION
KIB
RS2
CS2
RING
RB3
PTC
Z1
VRING RB4
150VPEAK(MAX)
SYSTEM CONTROLLER
SHD GKD PRI RS TEST F1 ALARM F0
RD
PR
ILIMIT
TIP
VRX+
TF1**
TF2**
VFB
RF2**
RF1**
SLIC
HC-5509A1
VTX
-IN1
RFS
OUT1
RL1
CAC
KRF
KZ0
RING
VB- BG
LAO
C2 *D*G* AG VB+ C1
C3 CF2
C4
+5V
RF2
RF1
CF1
RL2
FROM PCM
FILTER/CODER
TO HYBIRD
BALANCE
NETWORK
FIGURE 1. TYPICAL LINE CIRCUIT APPLICATION WITH THE MONOLITHIC SLIC
TYPICAL COMPONENT VALUES
C1 = 0.5µF, 30V
RF1 = RF2 = 210kΩ, 1%
CF1 = CF2 = 0.22µF, 10%, 20V Nonpolarized
C3 = 0.01µF, 100V, ±20%
C4 = 0.01µF, 100V, ±20%
C5 = 0.01µF, 100V, ±20%
CAC = 0.5µF, 20V
KZ0 = 60kΩ, (Z0 = 600Ω, K = Scaling Factor = 100)
RL1, RL2; Current Limit Setting Resistors:
KRF = 20kΩ, RF = 2(RB2 + RB4), K = Scaling Factor = 100)
RB1 = RB2 = RB3 = RB4 = 50Ω (1% absolute, matching
requirements covered in a Tech Brief)
RS1 = RS2 = 1kΩ typically
CS1 = CS2 = 0.1µF, 200V typically, depending on VRing and
line length.
Z1 = 150V to 200V transient protector. PTC used as ring
generator ballast.
* Secondary protection diode bridge recommended is 3A, 200V
type.
RL1 + RL2 > 90kΩ → offset
ILIMIT = (0.6) (RL1 + RL2)/(200 x RL2), RL1 typically 100kΩ
**TF1, TF2 and RF1, RF2 are on PLCC only and should be con-
nected together as shown.
***Not Present on DIP or SOIC packages.
NOTES:
1. All grounds (AG, BG, & DG) must be applied before VB+ or VB-. Failure to do so may result in premature failure of the part. If a user wishes
to run separate grounds off a line card, the AG must be applied first.
2. Application shows Ring Injected Ringing, a Balanced or Tip injected configuration may be used.
Additional information is contained in Application Note 549, “The HC-550X Telephone SLICs” By Geoff Phillips
8-140
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