FAN5009 데이터 시트보기 (PDF) - Fairchild Semiconductor
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FAN5009 Datasheet PDF : 13 Pages
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PRODUCT SPECIFICATION
FAN5009
Absolute Maximum Ratings
Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at these or other conditions beyond those indicated in
the operational section of this specification is not implied. Exposure to the absolute maximum rating conditions for
extended periods may affect device reliability. Absolute maximum ratings apply individually, not in combination.
Unless otherwise specified, voltages are referenced to PGND.
Parameter
VCC to PGND
PWM and OD pins
SW to PGND
BOOT to SW
BOOT to PGND
HDRV
LDRV
Continuous
Transient ( t=100nsec, F≤500kHz)
Continuous
Transient ( t=100nsec, F≤500kHz)
Continuous
Transient ( t=200nsec)
Min.
–0.3
–0.3
–1
–5(1)
–0.3
–0.3
VSW–1
–0.5
–2(1)
Max.
15
5.5
15
25
15
30
33(1)
VBOOT+0.3
VCC+0.3
Units
V
V
V
V
V
V
V
V
V
V
Notes:
1. For transient derating beyond the levels indicated, refer to the graphs on page 7.
Thermal Information
Parameter
Junction Temperature (TJ)
Storage Temperature
Lead Soldering Temperature, 10 seconds
Vapor Phase, 60 seconds
Infrared, 15 seconds
Power Dissipation (PD) TA = 25°C
Thermal Resistance, SO8 – Junction to Case θJC
Thermal Resistance, SO8 – Junction to Ambient θJA
Thermal Resistance, MLP – Junction to Paddle θJC
Min.
0
–65
Typ.
40
140
4
Max.
150
150
300
215
220
715
Units
°C
°C
°C
°C
°C
mW
°C/W
°C/W
°C/W
Recommended Operating Conditions
Parameter
Supply Voltage VCC
Ambient Temperature (TA)
Junction Temperature (TJ)
Conditions
VCC to PGND
Min.
10
0
0
Typ.
12
Max.
13.5
85
125
Units
V
°C
°C
REV. 1.0.5 7/22/04
3
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