CY7C1346H
Capacitance[10]
Parameter
Description
CIN
CCLK
CI/O
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance[10]
Test Conditions
TA = 25°C, f = 1 MHz,
VDD = 3.3V.
VDDQ = 2.5V
Parameter
ΘJA
ΘJC
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
AC Test Loads and Waveforms
Test Conditions
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA/JESD51
100 TQFP
Max.
5
5
5
100 TQFP
Package
30.32
6.85
Unit
pF
pF
pF
Unit
°C/W
°C/W
3.3V I/O Test Load
OUTPUT
Z0 = 50Ω
3.3V
OUTPUT
RL = 50Ω
5 pF
VL = 1.5V
(a)
INCLUDING
JIG AND
SCOPE
R = 317Ω
R = 351Ω
(b)
VDDQ
GND
ALL INPUT PULSES
10%
90%
≤ 1 ns
90%
10%
≤ 1 ns
(c)
2.5V I/O Test Load
OUTPUT
Z0 = 50Ω
2.5V
OUTPUT
RL = 50Ω
5 pF
VT = 1.25V
(a)
INCLUDING
JIG AND
SCOPE
R = 1667Ω
R =1538Ω
VDDQ
GND
ALL INPUT PULSES
10%
90%
≤ 1 ns
90%
10%
≤ 1 ns
(b)
(c)
Note:
10. Tested initially and after any design or process change that may affect these parameters.
Document #: 38-05672 Rev. *B
Page 9 of 16
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