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CXD1159AQ 데이터 시트보기 (PDF) - Sony Semiconductor
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CXD1159AQ
Sync Signal Generator for Camera
Sony Semiconductor
CXD1159AQ Datasheet PDF : 10 Pages
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10
Package Outline
Unit: mm
24
25
32PIN QFP (PLASTIC)
9.0 ± 0.2
+ 0.3
7.0
–
0.1
17
16
CXD1159AQ
0.1
+ 0.35
1.5
–
0.15
A
32
1
0.8
9
8
b
0.24 M
+ 0.15
b = 0.30 – 0.10
( 0.30)
+ 0.2
0.1
–
0.1
0˚ to 10˚
SONY CODE
EIAJ CODE
JEDEC CODE
QFP-32P-L01
P-QFP32-7x7-0.8
DETAIL
A
: SOLDER
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42 / COPPER ALLOY
0.2g
LEAD SPECIFICATIONS
ITEM
LEAD MATERIAL
LEAD TREATMENT
LEAD TREATMENT THICKNESS
SPEC.
ALLOY 42
Sn-Pb 10%
5-18µm
–
10
–
Sony Corporation
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