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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

CS8140 데이터 시트보기 (PDF) - Cherry semiconductor

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CS8140 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
PARAMETER
s RESET
Threshold
HIGH VR(HI)
LOW VR(LOW)
Threshold Hysteresis(VRH)
Reset Output Leakage
RESET = HIGH
Output Voltage
Low(VL(LOW) )
Low (VRpeak )
Delay Times
tPOR
tWDI( RESET )
Electrical Characteristics: continued
TEST CONDITIONS
MIN
VOUT increasing
4.65
VOUT decreasing
4.50
(HIGH - LOW)
150
VOUT ³ VR(HI)
1V ² VOUT ² VR(LOW)
Rp = 2.7k½*
VOUT, Power up, Power down
CDELAY = 0.1µF
30.0
0.5
TYP
MAX
UNIT
4.90
VOUT - 0.05 V
4.70
4.90
V
200
250
mV
25
µA
0.1
0.4
V
0.6
1.0
V
47.5
65.0
ms
1.0
1.5
ms
s Watchdog
Input Voltage
HIGH
LOW
Input Current
Threshold Frequency
fWDILOWER
fWDI(UPPER)**
WDI ² VOUT
CDELAY = 0.1µF
2.0
0
64
77
218
262
V
0.8
V
10
µA
96
Hz
326
Hz
* RP is connected to RESET and VOUT.
** CS8140 only
To observe safe operating junction temperature, low duty cycle pulse testing is used on tests where applicable.
Package Lead Description
Package Lead #
Lead Symbol
Function
7 Lead
TO-220
1
2
24 Lead *
SOIC Wide
21
23
14 Lead
PDIP
12
13
VIN
ENABLE
Supply voltage to IC, usually direct from the battery.
CMOS compatible logical input. VOUT is disabled when
ENABLE is LOW and WDI is beyond its preset limits.
3
24
14
RESET
CMOS compatible output lead. RESET goes low whenever
VOUT drops below 4.5% of its typical value for more than
2µs or WDI signal falls outside itÕs window limits.
4
12, 20
11
Gnd
Ground connection.
5
2
1
Delay
Timing capacitor for Watchdog and RESET functions.
6
3
2
WDI
CMOS compatible input lead. The Watchdog function mon-
itors the falling edge of the incoming digital pulse train. The
signal is usually generated by the system microprocessor.
7
4
N/A
5
3
VOUT
Regulated output voltage, 5V (typ).
4
Sense
Kelvin connection which allows remote sensing of output
voltage for improved regulation.
1,6-11,13-19,22
5-10
NC
No connection.
* The CS8141 uses a fused lead package. Leads 6-8 and 17-19 are fused together through the lead frame. These leads are
electrically connected to IC ground and should be connected to system ground for a good thermal connection.
3

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