BYT01-400 데이터 시트보기 (PDF) - STMicroelectronics
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BYT01-400 Datasheet PDF : 5 Pages
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BYT01-400
Fig. 1: Average forward power dissipation versus
average forward current.
PF(av)(W)
1.8
1.6
δ = 0.05 δ = 0.1 δ = 0.2
δ = 0.5
1.4
δ=1
1.2
1.0
0.8
0.6
0.4
T
0.2
IF(av)(A)
δ=tp/T
tp
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5)
IF(av)(A)
1.2
1.0
Rth(j-a)=Rth(j-l)
0.8
0.6
Rth(j-a)=100°C/W
0.4
0.2
0.0
0
Tamb(°C)
25
50
75
100
125
150
Fig. 3: Thermal resistance versus lead length.
Rth(°C/W)
110
100
Rth(j-a)
90
80
70
60
Rth(j-l)
50
40
30
20
10
Lleads(mm)
0
5
10
15
20
25
Fig. 4: Relative variation of thermal impedance
junction ambient versus pulse duration (printed
circuit board epoxy FR4, Lleads = 10mm).
Zth(j-a)/Rth(j-a)
1.0
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1 Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Fig. 5: Forward voltage drop versus forward current.
IFM(A)
100.0
10.0
Tj=100°C
(Maximum values)
Tj=100°C
(Typical values)
1.0
Tj=25°C
(Maximum values)
VFM(V)
0.1
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
10
9
8
7
6
5
4
3
2
1
0
1
F=1MHz
Vosc =30mV
Tj=25°C
VR(V)
10
100
1000
3/5
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