RB521S30,115 데이터 시트보기 (PDF) - NXP Semiconductors.
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RB521S30,115 Datasheet PDF : 12 Pages
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NXP Semiconductors
RB521S30
200 mA low VF MEGA Schottky barrier rectifier
10. Packing information
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000 8000 10000
RB521S30 SOD523 2 mm pitch, 8 mm tape and reel
-
-315 -
4 mm pitch, 8 mm tape and reel
-115 -
-135
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
2.15
1.1
0.5 0.6
1.2
(2×) (2×)
0.7
(2×)
0.8
(2×)
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering footprint SOD523 (SC-79)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod523_fr
RB521S30_1
Product data sheet
Rev. 01 — 6 October 2009
© NXP B.V. 2009. All rights reserved.
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