MAX17491 데이터 시트보기 (PDF) - Maxim Integrated

부품명

상세내역

일치하는 목록

MAX17491

Single-Phase Synchronous MOSFET Driver

Maxim Integrated 

Single-Phase Synchronous MOSFET Driver

Switching losses in the high-side MOSFET can become

an insidious heat problem when maximum AC adapter

voltages are applied due to the squared term in the

switching-loss equation above. If the high-side MOSFET

chosen for adequate RDS(ON) at low battery voltages

becomes extraordinarily hot when biased from VIN(MAX),

consider choosing another MOSFET with lower parasitic

capacitance.

For the low-side MOSFET (NL), the worst-case power

dissipation always occurs at the maximum input voltage:

PD (NL

RESISTIVE)

=

⎡

⎢1−

⎣⎢

⎛

⎝⎜

VOUT

VIN(MAX)

⎞

⎠⎟

⎤

⎥

⎦⎥

⎛

⎝⎜

ILOAD

ηTOTAL

⎞

⎠⎟

2

RDS(ON)

The worst case for MOSFET power dissipation occurs

under heavy load conditions that are greater than

ILOAD(MAX), but are not quite high enough to exceed

the current limit and cause the fault latch to trip. The

MOSFETs must have a good-sized heatsink to handle

the overload power dissipation. The heatsink can be a

large copper field on the PCB or an externally mounted

device.

An optional Schottky diode only conducts during the

dead time when both the high-side and low-side

MOSFETs are off. Choose a Schottky diode with a

forward voltage low enough to prevent the low-side

MOSFET body diode from turning on during the dead

time, and a peak current rating higher than the peak

inductor current. The Schottky diode must be rated to

handle the average power dissipation per switching

cycle. This diode is optional and can be removed if effi-

ciency is not critical.

IC Power Dissipation and

Thermal Considerations

Power dissipation in the IC package comes mainly from

driving the MOSFETs. Therefore, it is a function of both

switching frequency and the total gate charge of the

selected MOSFETs. The total power dissipation when

both drivers are switching is given by:

PD(IC) = IBIAS × 5V

where IBIAS is the bias current of the 5V supply calcu-

lated in the 5V Bias Supply (VDD) section. The rise in

die temperature due to self-heating is given by the

following formula:

ΔTJ = θJA × PD(IC)

where PD(IC) is the power dissipated by the device,

and θJA is the package’s thermal resistance. The typi-

cal thermal resistance is 42°C/W for the 3mm x 3mm

TQFN package.

Avoiding dV/dt Turning on the

Low-Side MOSFET

At high input voltages, fast turn-on of the high-side

MOSFET can momentarily turn on the low-side MOSFET

due to the high dV/dt appearing at the drain of the low-

side MOSFET. The high dV/dt causes a current flow

through the Miller capacitance (CRSS) and the input

capacitance (CISS) of the low-side MOSFET. Improper

selection of the low-side MOSFET that results in a high

ratio of CRSS/CISS makes the problem more severe. To

avoid this problem, minimize the ratio of CRSS/CISS

when selecting the low-side MOSFET. Adding a 1Ω to

4.7Ω resistor between BST and CBST can slow the

high-side MOSFET turn-on. Similarly, adding a small

capacitor from the gate to the source of the high-side

MOSFET has the same effect. However, both methods

work at the expense of increased switching losses.

Layout Guidelines

The MAX17491 MOSFET driver sources and sinks large

currents to drive MOSFETs at high switching speeds.

The high di/dt can cause unacceptable ringing if the

trace lengths and impedances are not well controlled.

The following PCB layout guidelines are recommended

when designing with the MAX17491:

1) Place all decoupling capacitors as close as possi-

ble to their respective IC pins.

2) Minimize the length of the high-current loop from

the input capacitor, the upper switching MOSFET,

and the low-side MOSFET back to the input-capacitor

negative terminal.

3) Provide enough copper area at and around the

switching MOSFETs and inductors to aid in thermal

dissipation.

4) Connect GND of the MAX17491 as close as possi-

ble to the source of the low-side MOSFETs.

A sample layout is available in the MAX17030 evaluation

kit.

10 ______________________________________________________________________________________

Share Link: