DG406 데이터 시트보기 (PDF) - Intersil
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DG406 Datasheet PDF : 13 Pages
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DG406, DG407
Absolute Maximum Ratings
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44.0V
GND to V-. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V
Digital Inputs, VS, VD (Note 1). . . . . . (V-) -2V to (V+) +2V or 20mA,
Whichever Occurs First
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . . . . 100mA
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Information
Thermal Resistance (Typical, Note1)
θJA (oC/W)
PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
60
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(PLCC and SOIC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. Signals on SX, DX, EN or AX exceeding V+ or V- are clamped by internal diodes. Limit diode current to maximum current ratings.
Electrical Specifications Test Conditions: V+ = +15V, V- = -15V, VAL = 0.8V, VAH = 2.4V Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
(NOTE 3) (NOTE 4) (NOTE 3)
TEMP (oC)
MIN
TYP
MAX
DYNAMIC CHARACTERISTICS
Transition Time, tTRANS
(See Figure 1)
25
-
200
300
Full
-
-
400
Break-Before-Make Interval, tOPEN
(See Figure 3)
25
25
50
-
Full
10
-
-
Enable Turn-ON Time, tON(EN)
(See Figure 2)
25
-
150
200
Full
-
-
400
Enable Turn-OFF Time, tOFF(EN)
25
-
Full
-
70
150
-
300
Charge Injection, Q
OFF Isolation, OIRR
CL = 1nF, VS = 0V, RS = 0Ω
25
-
40
-
VEN = 0V, RL = 1kΩ,
f = 100kHz (Note 7)
25
-
-69
-
Logic Input Capacitance, CIN
Source OFF Capacitance, CS(OFF)
f = 1MHz
VEN = 0V, VS = 0V,
f = 1MHz
25
-
7
-
25
-
8
-
Drain OFF Capacitance, CD(OFF)
DG406
VEN = 0V, VD = 0V,
f = 1MHz
25
-
160
-
DG407
25
-
80
-
Drain ON Capacitance, CD(ON)
DG406
VEN = 5V, VD = 0V,
f = 1MHz
25
-
180
-
DG407
25
-
90
-
DIGITAL INPUT CHARACTERISTICS
Logic High Input Voltage, VINH
Logic Low Input Voltage, VINL
Logic High Input Current, IAH
Logic Low Input Current, IAL
ANALOG SWITCH CHARACTERISTICS
VA = 2.4V, 15V
VEN = 0V, 2.4V, VA = 0V
Full
2.4
-
-
Full
-
-
0.8
Full
-1
-
1
Full
-1
-
1
Drain-Source ON Resistance, rDS(ON)
VD = ±10V, IS = +10mA (Note 5)
25
-
Full
-
50
100
-
125
rDS(ON) Matching Between Channels,
∆rDS(ON)
VD = 10V, -10V (Note 6)
25
-
5
-
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
pC
dB
pF
pF
pF
pF
pF
pF
V
V
µA
µA
Ω
Ω
%
4
FN3116.9
March 13, 2006
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