AD7545BN(1997) 데이터 시트보기 (PDF) - Intersil
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AD7545BN Datasheet PDF : 7 Pages
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Die Characteristics
DIE DIMENSIONS:
121 mils x 123 mils (3073micrms x 3124micrms)
METALLIZATION:
Type: Pure Aluminum
Thickness: 10 ±1kÅ
AD7545
PASSIVATION:
Type: PSG/Nitride
PSG: 7 ±1.4kÅ
Nitride: 8 ±1.2kÅ
PROCESS:
CMOS Metal Gate
Metallization Mask Layout
PIN 7
DB8
PIN 6
DB9
AD7545
PIN 5
DB10
PIN 4
DB11
(MSB)
PIN 3
DGND
PIN 2
AGND
PIN 8
DB7
PIN 1
OUT1
PIN 9
DB6
PIN 10
DB5
PIN 11
DB4
PIN 12
DB3
PIN 20
RFEEDBACK
PIN 19
VREF
PIN 13
DB2
PIN 18
VDD
PIN 14
DB1
PIN 15
DB0
(LSB)
PIN 16
CS
PIN 17
WR
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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