![](/html/Sony/104976/page8.png)
Package Outline
Unit: mm
HSOF 26PIN(PLASTIC)
0.9 ± 0.1
*5.6 ± 0.05
A
26
14
0.08 S
5.5
4.2
CXG1053FN
1
13
0.4
S
0.07 M S A
0.2
4.4
0.2
Solder Plating
0.2 ± 0.05
B
NOTE: Dimension “∗” does not include mold protrusion.
+ 0.05
0.14 – 0.03
DETAILB
SONY CODE
EIAJ CODE
JEDEC CODE
HSOF-26P-01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
0.06g
–8–