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GP2W0106YP

115 kbps Transceiver

Sharp Electronics 

115 kbps Transceiver

GP2W0106YP

OUTGOING INSPECTION

• Inspection lot: Inspection shall be carried out per

each delivery lot.

• Inspection method: A single sampling plan, normal

inspection level two based on ISO 2859 shall be

adopted.

Table 2. Outgoing Inspection

PARAMETER

INSPECTION ITEMS AND

TEST METHOD

Disconnection, short

Major defect

Inverse polarity on terminal

Soldering defect (obstacle to

use)

Electrical characteristic defect

Minor defect

Appearance defect which

affects the electrical character-

istics such as, split, chip,

scratch, stain, or blur

AQL(%)

0.1

0.1

0.1

0.1

0.25

PRECAUTIONS FOR SOLDERING

Solder Reflow

Solder only once at the temperature and the time

within the temperature profile as shown in Figure 16.

Other Precautions

An infrared lamp used to heat up for soldering may

cause a localized temperature rise in the resin. Keep the

package temperature within that specified in Figure 16.

Also avoid immersing the resin part in the solder. Even if

within the temperature profile shown in Figure 16, there

is the possibility that the gold wire in the package may

break if the deformation of the PCB affects the lead pins.

Use after fully confirming the conditions of actual solder

reflow machine.

Soldering

• Soldering iron shall be less than 25 W, and temper-

ature of soldering iron point shall be used at less

than 260°C.

• Soldering time shall be within 5 seconds.

• Soldered product shall treat at normal temperature.

• Solder: 6/4 solder or included Ag solder.

230°C

MAX.

200°C

165°C

MAX.

1 - 4°C/s

1 - 4°C/s

1 - 4°C/s

25°C

IrDA Data Sheet

120 s MAX.

5 s MAX.

60 s MAX.

90 s MAX.

Figure 16. Temperature Profile

GP2W0106YP-16

11

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