DPG10I200PA 데이터 시트보기 (PDF) - IXYS CORPORATION

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DPG10I200PA

HiPerFRED²

IXYS CORPORATION 

DPG 10 I 200 PA

Ratings

Symbol

I RMS

RthCH

Tstg

Weight

Definition

RMS current

thermal resistance case to heatsink

storage temperature

Conditions

per pin 1)

min. typ. max. Unit

35 A

0.50

K/W

-55

150 °C

2

g

MD

mounting torque

F

mounting force with clip

C

0.4

0.6 Nm

20

60 N

1) IRMS is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.

In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting

the backside.

Product Marking

Marking on product

Logo

DateCode

Assembly Code

abcdef

YYWW

XXXXXX

Part number

D = Diode

P = HiPerFRED

G = extreme fast

10 = Current Rating [A]

I = Single Diode

200 = Reverse Voltage [V]

PA = TO-220AC (2)

Ordering

Standard

Part Name

DPG 10 I 200 PA

Marking on Product

DPG10I200PA

Delivering Mode Base Qty Code Key

Tube

50

506301

Similar Part

DPG10I200PM

Package

TO-220ACFP (2)

Voltage Class

200

IXYS reserves the right to change limits, conditions and dimensions.

© 2009 IXYS all rights reserved

Data according to IEC 60747and per diode unless otherwise specified

20090323a

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