MBF4 데이터 시트보기 (PDF) - Shenzhen Luguang Electronic Technology Co., Ltd
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MBF4 Datasheet PDF : 2 Pages
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MBF2-MBF10
Schottky Surface Mount Flat Bridge Rectifier
MBS
Features
Low profile package
Ideal for automated placement
Ultrafast reverse recovery time
Low power losses, high efficiency
Low forward voltage drop
High surge capability
High temperature soldering：
260℃/10 seconds at terminals
.193(4.90)
.177(4.50)
.033(0.84)
.022(0.56)
.157(4.00)
.142(3.60)
.272(6.9)
MAX
.102(2.60)
.087(2.20)
.106(2.70)
.090(2.30)
.053(1.53) .014(0.35
.037(0.95) .006(0.15
.008(0.20) .114(2.9)
MAX
MAX
.043(1.10) .083(2.12)
.028(0.70) .043(1.10)
Mechanical Date
Case: MBF molded plastic body over
Schottky barrier chips
Polarity: Polarity symbols marked on body
Dimensions in inches and (millimeters)
Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(TA = 25 °C unless otherwise noted)
Symbol MBF2 MBF4 MBF6 MBF8 MBF10 UNIT
Maximum repetitive peak reverse voltage
VRRM
20
40
60
80
100
V
Maximum RMS voltage
VRMS
14
28
42
56
70
V
Maximum DC blocking voltage
Maximum average forward rectified current
0.2×0.2"(5.0×5.0mm)copper pad area
VDC
20
40
60
80
100
V
IF(AV)
1.0
A
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
IFSM
30
A
Maximum instantaneous forwad voltage at 1.0A VF
0.50 0.55 0.70
0.85
Maximum DC reverse current
at Rated DC blocking voltage
TA = 25 ℃
TA = 100℃
IR
0.5
20
Typical Junction Capacitance at 4.0V,1.0MHz
CJ
250
125
Typical Thermal resistance (Note1)
RθJA
RθJL
85
20
Operating junction temperature range
TJ
–55 to +125
Storage temperature range
TSTG
– 55 to +150
Note：1.Thermal resistance from junction to ambient and from junction to lead P.C.B.mounted on 0.2×0.2"(5.0×5.0mm)copper pad areas.
V
mA
pF
℃/ W
℃
℃
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mail:lge@luguang.cn
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