GRM219R60J475ME32 데이터 시트보기 (PDF) - Murata Manufacturing
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GRM219R60J475ME32 Datasheet PDF : 30 Pages
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2. Land Dimensions
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Chip Capacitor
Land
Table 1 Flow Soldering Method
Series
Chip Dimension(L/W) Code
Chip(L×W)
b
a
a
b
GRM
18
1.6×0.8
0.6 to 1.0
0.8 to 0.9
GRM
21
2.0×1.25
1.0 to 1.2
0.9 to 1.0
GRM
31
3.2×1.6
2.2 to 2.6
1.0 to 1.1
Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.
Table 2 Reflow Soldering Method
Series
Chip Dimension(L/W) Code
Chip(L×W)
(Dimensions Tolerance)
GRM
01
0.25×0.125
GRM
02
0.4×0.2
GRM
GRM
GRM
GRM
GRM
GRM
GRM
GRM
MD
0.5×0.25
0.6×0.3
(+/-0.03)
03
0.6×0.3
(+/-0.05)
0.6×0.3
(+/-0.09)
1.0×0.5
15
(within +/-0.10)
1.0×0.5
（+/-0.15/+/-0.20）
1.6×0.8
18
(within +/-0.10)
1.6×0.8
(+/-0.15/+/-0.20)
JN
1.8×1.0
2.0×1.25
(within +/-0.10)
21
2.0×1.25
(+/-0.15)
2.0×1.25
(+/-0.20)
3.2×1.6
31
(within+/-0.20)
3.2×1.6
(+/-0.30)
32
3.2×2.5
GRM
43
4.5×3.2
GRM
55
5.7×5.0
a
0.10 to 0.11
0.16 to 0.2
0.17 to 0.23
0.2 to 0.25
0.2 to 0.25
0.23 to 0.3
0.3 to 0.5
0.4 to 0.6
0.6 to 0.8
0.7 to 0.9
0.8 to 0.9
1.2
1.2
1.0 to 1.4
1.8 to 2.0
1.9 to 2.1
2.0 to 2.4
3.0 to 3.5
4.0 to 4.6
b
0.07 to 0.12
0.12 to 0.18
0.22 to 0.28
0.2 to 0.3
0.25 to 0.35
0.25 to 0.35
0.35 to 0.45
0.4 to 0.5
0.6 to 0.7
0.7 to 0.8
0.6 to 0.8
0.6
0.6 to 0.8
0.6 to 0.8
0.9 to 1.2
1.0 to 1.3
1.0 to 1.2
1.2 to 1.4
1.4 to 1.6
GRM219R60J475ME32-01A
Solder Resist
c
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
(in mm)
c
0.125 to 0.145
0.2 to 0.23
0.25 to 0.30
0.25 to 0.35
0.3 to 0.4
0.3 to 0.4
0.4 to 0.6
0.5 to 0.7
0.6 to 0.8
0.8 to 1.0
0.9 to 1.1
1.25
1.2 to 1.4
1.2 to 1.4
1.5 to 1.7
1.7 to 1.9
1.8 to 2.3
2.3 to 3.0
3.5 to 4.8
(in mm)
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