GRM219R60J475ME32 데이터 시트보기 (PDF) - Murata Manufacturing

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GRM219R60J475ME32

Chip Multilayer Ceramic Capacitors for General Purpose

Murata Manufacturing 

4-2.Flow Soldering

1. Do not apply flow soldering to chips not listed in Table 2.

Table 2

Series

Chip　Dimension(L/W)　Code Temperature Differential

GRM

18/21/31

ΔT≦150℃

2. When sudden heat is applied to the components, the mechanical strength of the components will

decrease because a sudden temperature change causes deformation inside the components.

In order to prevent mechanical damage to the components, preheating is required for both of the

components and the PCB.

Preheating conditions are shown in table 2.

It is required to keep the temperature differential between the solder and the components surface

(ΔT) as low as possible.

3. Excessively long soldering time or high soldering temperature can result in leaching of the

terminations, causing poor adhesion or a reduction in capacitance value due to loss of contact

between the inner electrodes and terminations.

4. When components are immersed in solvent after mounting, be sure to maintain the temperature

differential (ΔT) between the component and solvent within the range shown in the table 2.

Recommended Conditions

Preheating Peak Temperature

Lead Free Solder

100 to 120℃

Soldering Peak Temperature

250 to 260℃

Atmosphere

Lead Free Solder: Sn-3.0Ag-0.5Cu

Air or N2

5. Optimum Solder Amount for Flow Soldering

5-1. The top of the solder fillet should be lower than the thickness of the components.

If the solder amount is excessive, the risk of cracking is higher during board

bending or any other stressful condition.

[Standard Conditions for Flow Soldering]

Temperature(℃)

Soldering

Peak

Temperature

Preheating

Peak

Temperature

Soldering

Gradual

ΔT

Cooling

Preheating

30 to 90 s

5 s max.

Time

[Allowable Flow Soldering Temperature and Time]

280

270

260

250

240

230

220

0

10

20

30

40

Soldering Time(s)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Up to Chip Thickness

Adhesive

in section

GRM219R60J475ME32-01A

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