GRM219R60J475KE32 데이터 시트보기 (PDF) - Murata Manufacturing
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GRM219R60J475KE32 Datasheet PDF : 30 Pages
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■Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking.
When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is different depending on PCB material and structure.
When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to the thermal expansion and contraction.
When capacitors are mounted on a fluorine resin printed circuit board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
Pattern Forms
Placing Close to
Chassis
Prohibited
Chassis
Solder (ground)
Correct
Solder Resist
Placing of Chip
Components
and Leaded
Components
Placing of Leaded
Components after
Chip Component
Lateral Mounting
Electrode Pattern
Lead Wire
in section
Soldering Iron
in section
Lead Wire
in section
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Solder Resist
in section
Solder Resist
in section
Solder Resist
in section
GRM219R60J475KE32-01A
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