MMG2401NR2 데이터 시트보기 (PDF) - Freescale Semiconductor
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MMG2401NR2 Datasheet PDF : 12 Pages
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PACKAGE DIMENSIONS
3
A
PIN 1 INDEX
AREA
M
2X
0.1 C
3
DETAIL G
B
M
2X
0.1 C
EXPOSED DIE
ATTACH PAD
9
1.55
1.25
10
12
DETAIL M
PIN 1 INDEX
1
1.55
1.25
3
7
DETAIL N
12X 0.75
0.50
6
12X 0.30
9
0.18
0.10 M C A B
4
8X 0.5
VIEW M - M
CASE 1483 - 01
ISSUE A
QFN 3x3
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
3. THE COMPLETE JEDEC DESIGNATOR FOR
THIS PACKAGE IS: HF−PQFP−N.
4. FOR ANVIL SINGULATED QFN PACKAGES,
MAXIMUM DRAFT ANGLED IS 12 _.
5. PACKAGE WARPAGE MAX 0.05 MM.
6. CORNER CHAMFER MAY NOT BE PRESENT.
DIMENSIONS OF OPTIONAL FEATURES ARE
FOR REFERENCE ONLY.
7. CORNER LEADS CAN BE USED FOR
THERMAL OR GROUND AND ARE TIED TO
THE DIE ATTACH PAD. THESE LEADS ARE
NOT INCLUDED IN THE LEAD COUNT.
8. COPLANARITY APPLIES TO LEAD, CORNER
LEADS, AND DIE ATTACH PAD.
9. THIS DIMENSION APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.20 MM AND 0.25 MM FROM TERMINAL TIP.
Page 1 of 3
RF Device Data
Freescale Semiconductor
MMG2401NR2
9
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