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LTC4307-1

High Defi nition Multimedia Interface (HDMI) Level-Shifting 2-Wire Bus Buffer

Linear Technology 

PACKAGE DESCRIPTION

DD Package

8-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1698)

0.675 ±0.05

LTC4307-1

R = 0.115

TYP

5

0.38 ± 0.10

8

3.5 ±0.05

1.65 ±0.05

2.15 ±0.05 (2 SIDES)

PACKAGE

OUTLINE

PIN 1

TOP MARK

(NOTE 6)

0.25 ± 0.05

0.50

BSC

2.38 ±0.05

(2 SIDES)

0.200 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

3.00 ±0.10

(4 SIDES)

1.65 ± 0.10

(2 SIDES)

0.75 ±0.05

0.00 – 0.05

4

0.25 ± 0.05

(DD8) DFN 1203

1

0.50 BSC

2.38 ±0.10

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660 Rev F)

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

8 7 65

0.52

(.0205)

REF

0.889 ± 0.127

(.035 ± .005)

0.254

(.010)

DETAIL “A”

0° – 6° TYP

4.90 ± 0.152

(.193 ± .006)

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

GAUGE PLANE

0.42 ± 0.038

(.0165 ± .0015)

TYP

0.65

(.0256)

BSC

RECOMMENDED SOLDER PAD LAYOUT

0.18

(.007)

0.53 ± 0.152

(.021 ± .006)

DETAIL “A”

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

1 234

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.65

(.0256)

BSC

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

0.86

(.034)

REF

0.1016 ± 0.0508

(.004 ± .002)

MSOP (MS8) 0307 REV F

43071fa

11

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