HMC566LP4E 데이터 시트보기 (PDF) - Analog Devices

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HMC566LP4E

GaAs pHEMT MMIC LOW NOISE AMPLIFIER

Analog Devices 

7

Outline Drawing

v02.0609

HMC566LP4E

GaAs pHEMT MMIC LOW NOISE

AMPLIFIER, 28 - 36 GHz

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.

Package Information

Part Number

Package Body Material

HMC566LP4E

RoHS-compliant Low Stress Injection Molded Plastic

[1] 4-Digit lot number XXXX

[2] Max peak reflow temperature of 260 °C

Lead Finish

100% matte Sn [2]

Package Marking [1]

H566

XXXX

7-5

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Trademarks and registered trademarks arAe tphepplriocpearttyioofntheSir urepsppecotivret:owPnehrso. ne: 978-250-3A3p4p3licaotrionaSpuppsp@orht:iPtthitoen.ec: o1-m800-ANALOG-D

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