HMC566 데이터 시트보기 (PDF) - Analog Devices
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HMC566 Datasheet PDF : 6 Pages
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v00.0306
Absolute Maximum Ratings
Drain Bias Voltage (Vdd1, 2, 3, 4)
RF Input Power (RFIN)(Vdd = +3.0 Vdc)
Channel Temperature
Continuous Pdiss (T= 85 °C)
(derate 9.6 mW/°C above 85 °C)
Thermal Resistance
(channel to die bottom)
Storage Temperature
Operating Temperature
+3.5 Vdc
+5 dBm
175 °C
0.82 W
104.2 °C/W
-65 to +150 °C
-55 to +85 °C
HMC566
GaAs PHEMT MMIC LOW NOISE
AMPLIFIER, 29 - 36 GHz
1
Typical Supply Current vs. Vdd
Vdd (Vdc)
Idd (mA)
+2.5
77
+3.0
80
+3.5
83
Note: Amplifier will operate over full voltage ranges shown
above.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
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