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MM908E626AVPEK

Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. MAXIMUM RATINGS

All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to

the device.

THERMAL RATINGS

Rating

Symbol

Value

Unit

Storage Temperature

Operating Case Temperature (5)

TSTG

TC

- 40 to 150

C

- 40 to 115

C

Operating Junction Temperature(6)

TJ

- 40 to 135

C

Peak Package Reflow Temperature During Solder Mounting (7)(8)

TPPRT

Note 8

C

Notes

5. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.

6. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because

of higher power dissipation on the analog die. The analog die temperature must not exceed 150 °C under these conditions

7. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.

908E626

6

Analog Integrated Circuit Device Data

Freescale Semiconductor

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