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ADSP-21367BBP-2A 데이터 시트보기 (PDF) - Analog Devices

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ADSP-21367BBP-2A
ADI
Analog Devices ADI
ADSP-21367BBP-2A Datasheet PDF : 56 Pages
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TABLE OF CONTENTS
Revision History ...................................................... 3
General Description ................................................. 4
Core Architecture ................................................. 4
Memory Architecture ............................................ 5
External Memory .................................................. 5
Input/Output Features ........................................... 7
System Design ...................................................... 9
Development Tools .............................................. 10
Additional Information ......................................... 11
Pin Function Descriptions ........................................ 12
Data Modes ........................................................ 15
Boot Modes ........................................................ 15
Core Instruction Rate to CLKIN Ratio Modes ............. 15
Specifications ......................................................... 16
Operating Conditions ........................................... 16
Electrical Characteristics ........................................ 16
Package Information ............................................ 17
ESD Caution ...................................................... 17
Maximum Power Dissipation ................................. 17
Absolute Maximum Ratings ................................... 17
Timing Specifications ........................................... 17
Output Drive Currents .......................................... 46
Test Conditions ................................................... 46
Capacitive Loading ............................................... 46
Thermal Characteristics ........................................ 48
256-Ball BGA_ED Pinout ......................................... 49
208-Lead LQFP_EP Pinout ....................................... 52
Package Dimensions ................................................ 53
Surface-Mount Design .......................................... 54
Ordering Guide ...................................................... 55
ADSP-21367/ADSP-21368/ADSP-21369
REVISION HISTORY
1/08—Rev. B to Rev. C
All outstanding document errata from the previous revision
of this data sheet has been corrected.
This revision replaces the MQFP package with the LQFP-EP
package. See Thermal Characteristics for 208-Lead LQFP EPAD
(With Exposed Pad Soldered to PCB) ...........................48
Ordering Guide ......................................................55
Rev. C | Page 3 of 56 | January 2008

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