ADSP-21367KSWZ-2A(RevG) 데이터 시트보기 (PDF) - Analog Devices

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ADSP-21367KSWZ-2A
(Rev.:RevG)

SHARC Processor

Analog Devices 

ADSP-21367/ADSP-21368

TABLE OF CONTENTS

General Description ................................................. 3

Maximum Power Dissipation ................................. 18

SHARC Family Core Architecture ............................ 4

Absolute Maximum Ratings ................................... 18

Family Peripheral Architecture ................................ 7

Timing Specifications ........................................... 18

I/O Processor Features ......................................... 10

Output Drive Currents ......................................... 51

System Design .................................................... 10

Test Conditions .................................................. 51

Development Tools ............................................. 11

Capacitive Loading .............................................. 51

Additional Information ........................................ 12

Thermal Characteristics ........................................ 53

Related Signal Chains .......................................... 12

Pin Function Descriptions ....................................... 13

Specifications ........................................................ 16

Operating Conditions .......................................... 16

Electrical Characteristics ....................................... 17

E Package Information ........................................... 18

ESD Caution ...................................................... 18

T REVISION HISTORY

9/2017—Rev. F to Rev. G

E Changes to Middleware Packages ................................ 12

Change to SDCLK1 Pin Description, Table 8 in Pin Function

Descriptions .......................................................... 13

L Changes to Table 24, Memory Read ............................. 30

Change to Endnote 1, Table 45 in

256-Ball BGA_ED Pinout ......................................... 54

O Changes to Figure 52, Package Dimensions ................... 59

Change to Table 47, Surface-Mount Design ................... 60

OBS Changes to Ordering Guide ....................................... 61

256-Ball BGA_ED Pinout ......................................... 54

208-Lead LQFP_EP Pinout ....................................... 57

Package Dimensions ............................................... 59

Surface-Mount Design .......................................... 60

Automotive Products .............................................. 61

Ordering Guide ..................................................... 61

Rev. G | Page 2 of 62 | September 2017

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