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HMC561LP3

SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT

Analog Devices 

Outline Drawing

v01.0407

HMC561LP3 / 561LP3E

SMT GaAs MMIC x2 ACTIVE FREQUENCY

MULTIPLIER, 8 - 21 GHz OUTPUT

7

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.

Package Information

Part Number

Package Body Material

HMC561LP3

Low Stress Injection Molded Plastic [4]

Lead Finish

Sn/Pb Solder

MSL Rating

MSL1 [1]

HMC561LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn

MSL1 [2]

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

[4] For availability on Non-RoHS HMC561LP3 products please contact Hittite Microwave sales directly.

Package Marking [3]

561

XXXX

561

XXXX

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Order On-line Trademarks and registered trademarks are the property of their respective owners. at www.hAiptptilticea.tcioonmSupport: Phone: 1-800-ANALOG-D

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