BAS21TW-0-T1-G 데이터 시트보기 (PDF) - Cystech Electonics Corp.
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BAS21TW-0-T1-G Datasheet PDF : 6 Pages
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CYStech Electronics Corp.
SOT-363 Dimension
Spec. No. : C335S6
Issued Date : 2017.01.03
Revised Date :
Page No. : 6/6
Marking:
Device Code
JS6
Date Code
6-Lead SOT-363 Plastic
Surface Mounted Package
CYStek Package Code: S6
Style:
Pin 1. Anode1 (A1)
Pin 2. Anode2 (A2)
Pin 3. Anode3 (A3)
Pin 4. Cathode3 (C3)
Pin 5. Cathode2 (C2)
Pin 6. Cathode1 (C1)
*:Typical
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
A
0.035 0.043 0.900 1.100 E1 0.085 0.096 2.150 2.450
A1 0.000 0.004 0.000 0.100
e
0.026*
0.650*
A2 0.035 0.039 0.900 1.000 e1 0.047 0.055 1.200 1.400
b
0.006 0.014 0.150 0.350
L
0.021 REF
0.525 REF
c
0.003 0.006 0.080 0.150 L1 0.010 0.018 0.260 0.460
D
0.079 0.087 2.000 2.200
θ
0°
8°
0°
8°
E
0.045 0.053 1.150 1.350
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BAS21TW
CYStek Product Specification
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