MC74LVX259DTG 데이터 시트보기 (PDF) - ON Semiconductor
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MC74LVX259DTG Datasheet PDF : 9 Pages
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MC74LVX259
ORDERING INFORMATION
Device
Package
Shipping†
MC74LVX259DG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74LVX259DR2G
SOIC−16
(Pb−Free)
2500 Tape & Reel
MC74LVX259DTG
TSSOP−16
(Pb−Free)
96 Units / Rail
MC74LVX259DTR2G
TSSOP−16
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
EMBOSSED CARRIER DIMENSIONS (See Notes 6 and 7)
Tape B1
Size Max
D
D1
E
F
K
P
P0
P2
R
T
W
8 mm 4.35 mm
(0.179”)
12 mm 8.2 mm
(0.323”)
1.5 mm
+ 0.1
−0.0
(0.059”
+0.004
−0.0)
1.0 mm
Min
(0.179”)
1.5 mm
Min
(0.060)
1.75 mm
±0.1
(0.069
±0.004”)
3.5 mm
±0.5
(1.38
±0.002”)
5.5 mm
±0.5
(0.217
±0.002”)
2.4 mm
Max
(0.094”)
6.4 mm
Max
(0.252”)
4.0 mm
±0.10
(0.157
±0.004”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
4.0 mm
±0.1
(0.157
±0.004”)
2.0 mm
±0.1
(0.079
±0.004”)
25 mm
(0.98”)
30 mm
(1.18”)
0.6 mm
(0.024)
8.3 mm
(0.327)
12.0 mm
±0.3
(0.470
±0.012”)
16 mm 12.1 mm
(0.476”)
7.5 mm
±0.10
(0.295
±0.004”)
7.9 mm
Max
(0.311”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
12.0 mm
±0.10
(0.472
±0.004”)
16.3 mm
(0.642)
24 mm 20.1 mm
(0.791”)
11.5 mm
±0.10
(0.453
±0.004”)
11.9 mm
Max
(0.468”)
16.0 mm
±0.10
(0.63
±0.004”)
24.3 mm
(0.957)
6. Metric Dimensions Govern−English are in parentheses for reference only.
7. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
http://onsemi.com
7
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