B57820M0561A005 데이터 시트보기 (PDF) - TDK Corporation

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B57820M0561A005

NTC thermistors for temperature measurement

TDK Corporation 

Temperature measurement and compensation

Leadless NTCs

B57820M

M820

Reflow soldering

Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D

Profile feature

Preheat and soak

- Temperature min

Tsmin

- Temperature max

Tsmax

- Time

tsmin to tsmax

Average ramp-up rate

Tsmax to Tp

Liquidous temperature

TL

Time at liquidous

tL

Peak package body temperature Tp1)

Time (tP)3) within 5 °C of specified

classification temperature (Tc)

Average ramp-down rate

Tp to Tsmax

Time 25 °C to peak temperature

Sn-Pb eutectic assembly

100 °C

150 °C

60 ... 120 s

3 °C/ s max.

183 °C

60 ... 150 s

220 °C ... 235 °C2)

20 s3)

6 °C/ s max.

maximum 6 min

Pb-free assembly

150 °C

200 °C

60 ... 180 s

3 °C/ s max.

217 °C

60 ... 150 s

245 °C ... 260 °C2)

30 s3)

6 °C/ s max.

maximum 8 min

1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.

3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Number of reflow cycles: 3

Please read Cautions and warnings and

Important notes at the end of this document.

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